After the design and application of high-power ultrasonic circuit boards, we have to mention their revolutionary impact in modern industry. These precision circuit boards, as the core of ultrasonic equipment, not only carry the task of converting and amplifying high-frequency electrical energy, but also cleverly guide the directional propagation of sound wave energy, enabling ultrasonic technology to shine in multiple fields such as cleaning, welding, testing, and medical care.

With the advancement of materials science and the rapid development of microelectronics technology, high-power ultrasonic circuit boards are moving towards higher efficiency, smaller size, and greater stability and reliability. The latest research focuses on using materials with stronger high-temperature resistance as substrates to cope with the high heat environment generated during ultrasonic work, while adopting advanced heat dissipation design to ensure long-term stable operation of circuit boards without damage.

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